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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND RESIN MOLDING
Document Type and Number:
Japanese Patent JP2009029863
Kind Code:
A
Abstract:

To provide a thermoplastic resin composition which excels in thermal stability and reduces the amount of formaldehyde generated in molding and in product usage to thereby improve a work environment in molding and a product usage environment, and which retains excellent biodegradability, reduces load on ambient surroundings and ensures excellent mechanical properties such as impact resistance.

The thermoplastic resin composition contains (C) a hydrazide compound and/or a disemicarbazide compound in (A) a polyoxymethylene resin and (B) a resin component comprising an aliphatic polyester resin containing 0-30 mol% of an aliphatic oxycarboxylic acid unit, 35-50 mol% of an aliphatic diol unit and 35-50 mol% of an aliphatic dicarboxylic acid unit. A resin molding obtained by molding the composition is also provided.


Inventors:
UEDA MOTONORI
NAKANO HIROSHI
Application Number:
JP2007192893A
Publication Date:
February 12, 2009
Filing Date:
July 25, 2007
Export Citation:
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Assignee:
MITSUBISHI ENG PLASTICS CORP
International Classes:
C08L59/00; C08K5/13; C08K5/25; C08K5/26; C08L67/00; C08L101/16