Title:
THERMOPLASTIC RESIN COMPOSITION AND SEALED ELECTRONIC PART
Document Type and Number:
Japanese Patent JP3702977
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition excellent in moldability and moisture resistance, greatly improved in molding strain, and suitable for sealing by using a thermoplastic aromatic resin and a thermoplastic aromatic norbornene based resin as the constituents.
SOLUTION: This composition contains a thermoplastic aromatic resin (A) having aromatic ring(s) in the backbone and a thermoplastic aromatic norbornene based resin (B) comprising, e.g. a ring-opening polymer of an aromatic norbornene monomer, a ring-opening copolymer of an aromatic norbornene monomer, with a nonaromatic norbornene monomer, or an adduct of an aromatic norbornene monomer with an aromatic vinyl compound at a weight ratio of component A to component B of (5:95) to (95:5). If necessary, other synthetic resin, an elastomer, and various additives can be blended with the composition.
Inventors:
Hosaka Ryo
Kazue Tsunogae
Kazue Tsunogae
Application Number:
JP30599496A
Publication Date:
October 05, 2005
Filing Date:
October 31, 1996
Export Citation:
Assignee:
Zeon Corporation
International Classes:
C08L65/00; C08L45/00; C08L67/03; C08L67/04; C08L71/00; C08L71/10; C08L81/02; H01L23/29; H01L23/31; (IPC1-7): C08L45/00; C08L67/03; C08L81/02; H01L23/29; H01L23/31
Domestic Patent References:
| JP2276816A | ||||
| JP5186682A | ||||
| JP7029417A | ||||
| JP7221128A |
Attorney, Agent or Firm:
Shigeaki Nishikawa
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