To obtain a thermoplastic resin composition imparted with antistaticity and having improved embossing workability by including a thermoplastic resin, a specific inorganic plate filler and an antistatic agent.

The objective composition contains (A) 100 pts.wt. of a thermoplastic resin having a glass transition temperature of preferably 70-170°C (e.g. polystyrene, styrene/acrylonitrile copolymer, styrene/butadiene/acrylonitrile copolymer, polyester and polycarbonate), (B) 0.5-25 pts.wt. of an inorganic plate filler having an average particle diameter of 0.5-20 μm (e.g. talc or kaolin) and (C) 0.02-10 pts.wt. of an antistatic agent (e.g. sodium n-hexylsulfonate, sodium n-nonylsulfonate and sodium n-octadecylsulfonate).