Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3124918
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition which can give a molding having good blocking resistance and slipperiness without detriment to transparency when processed into films or sheet, while it retains excellent properties of a thermoplastic resin.
SOLUTION: This thermoplastic resin composition comprises 100 pts.wt. thermoplastic resin and 0.1-10 pts.wt. spherical silicone gel particles having a mean particle diameter of 0.1-5μm and surface-treated with at least one member selected from the group consisting of organosiloxanediols of formula I (wherein R is methyl, trimethylsiloxy, vinyl or 3,3,3-trifluoropropyl) and organosiloxanediols of formula II (wherein R is as defined above; and (a) is 0, 1, 2 or 3).
Inventors:
Mitsuhiro Takarada
Shohei Kosakai
Masatoshi Asano
Akira Yamamoto
Shohei Kosakai
Masatoshi Asano
Akira Yamamoto
Application Number:
JP27060695A
Publication Date:
January 15, 2001
Filing Date:
September 25, 1995
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08J5/00; C08J5/18; C08K5/54; C08K5/5415; C08K5/5419; C08K7/16; C08L101/00; (IPC1-7): C08L101/00; C08J5/00; C08J5/18; C08K5/5415
Domestic Patent References:
| JP586295A |
Attorney, Agent or Firm:
Shuji Iwamiya