Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3453891
Kind Code:
B2
Abstract:
PURPOSE: To obtain a thermoplastic resin composition which is excellent in moldability and can give a molding excellent in conductivity, antistatic properties, impact resistance and rigidity.
CONSTITUTION: This composition comprises 100 pts.wt., in total, 20-70 pts.wt. crystalline olefin resin (A) and 80-30 pts.wt. saturated polyester (B), 2-40 pts.wt., per 100 pts.wt. total of components A and B, modified resin (C) obtained by subjecting 100 pts.wt. hydrogenated aromatic vinyl compound/conjugated diene block copolymer, 0.05-50 pts.wt. unsaturated hydroxy compound and 0-50 pts.wt. aromatic vinyl compound to a graft polymerization reaction and 2-100 pts.wt., per 100 pts.wt. total of components B and C, conductive substance (D). It is desirable that the rate of residual hydroxyl groups of the modified resin is 0.3-1.0.
Inventors:
Nobuhiro Shibuya
Application Number:
JP1088795A
Publication Date:
October 06, 2003
Filing Date:
January 26, 1995
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
C08K3/04; C08F285/00; C08F287/00; C08K3/08; C08L23/00; C08L51/06; C08L67/00; C08L67/02; (IPC1-7): C08L23/00; C08K3/04; C08L51/06; C08L67/02
Domestic Patent References:
| JP841301A | ||||
| JP83250A |
Attorney, Agent or Firm:
Koji Hasegawa
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