Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH05214245
Kind Code:
A
Abstract:
PURPOSE:To provide the title composition having excellent impact resistance, heat resistance, chemical resistance, moldability and dimensional stability and a good molding appearance. CONSTITUTION:The title composition comprises 100 pts.wt. total of 99-1wt.% polyamide resin and 1-99wt.% at least one member selected among a polyphenylene ether resin, a mixture thereof with a styrene polymer and a polycarbonate resin and 0.1-50 pts.wt. olefinic graft copolymer comprising 30-99.5wt.% units of an olefin monomer, 0.5-70wt.% units of a macromonomer containing a (meth)acryloyl group at one terminal and having a number-average molecular weight of 2000-20000 and 0-40wt.% units of another radical- polymerizable monomer.
Inventors:
SUGA KATSUFUMI
YOSHITOMI HIROAKI
AZUMA TAKASHIRO
TSUDA TAKASHI
YOSHITOMI HIROAKI
AZUMA TAKASHIRO
TSUDA TAKASHI
Application Number:
JP4768092A
Publication Date:
August 24, 1993
Filing Date:
February 04, 1992
Export Citation:
Assignee:
NIPPON PETROCHEMICALS CO LTD
TOA GOSEI CHEM IND
TOA GOSEI CHEM IND
International Classes:
C08L25/04; C08L51/00; C08L69/00; C08L71/00; C08L73/00; C08L77/00; (IPC1-7): C08L25/04; C08L51/00; C08L69/00; C08L77/00
Attorney, Agent or Firm:
Tatsuo Ito (1 outside)