Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH06240071
Kind Code:
A
Abstract:
PURPOSE: To obtain a molding excellent in impact resistance, elasticity and dimensional accuracy.
CONSTITUTION: This resin composition comprises 10-90wt.% silyl- or epoxy- containing copolymer obtained by copolymerizing 0.01-30wt.% unsaturated monomer selected from a silyl-containing α,β-unsaturated monomer and an epoxy- containing α,β-unsaturated monomer with 20-99.89wt.% aromatic vinyl compound and 0.1-50wt.% acrylonitrile or methacrylonitrile and 90-10wt.% hydroxy olefin resin.
Inventors:
TOMITA MASAYUKI
NAKANO HIROSHI
ARAKI YUUSUKE
NAKANO HIROSHI
ARAKI YUUSUKE
Application Number:
JP2443193A
Publication Date:
August 30, 1994
Filing Date:
February 12, 1993
Export Citation:
Assignee:
MITSUBISHI PETROCHEMICAL CO
International Classes:
C08L23/26; C08L23/00; C08L25/02; C08L33/18; C08L43/00; C08L43/04; C08L101/00; (IPC1-7): C08L23/26; C08L25/02; C08L33/18; C08L43/04; C08L101/00
Attorney, Agent or Firm:
Takaya Yamamoto
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