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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH07150035
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermoplastic resin composition, comprising an aromatic polysulfone resin, a polyamide resin and an amino group-containing aromatic polysulfone resin and excellent in balance among physical properties such as heat and chemical resistances and moldability.

CONSTITUTION: This thermoplastic resin composition comprises (A) 5-95wt.% aromatic polysulfone resin, (B) 95-5wt.% polyamide resin (e.g. nylon 6) and (C) an aromatic polysulfone resin having amino groups in an amount of ≥20×10-6 equiv. based on 1g resin in an amount of 1-95wt.% based on the total amount of the resin composition. Furthermore, the component (A) is preferably a resin at (10-60):(40-90) mol% ratio of a unit, produced by condensing hydroquinone with a dihalogenosulfone compound and expressed by formula I to a unit, produced by condensing 4,4'-biphenol with the dihalogenosulfone compound and expressed by formula II. The component (C) is prepared by using, e.g. a dihydric phenol compound and a bivalent aminophenol compound in combination. p-Aminophenol is preferred as the bivalent aminophenol compound.


Inventors:
ASANO YUKIHIKO
DOI KAZUHIRO
KAMEI EIICHI
ISHIKAWA SEIJI
NAKATANI MASAYUKI
Application Number:
JP29933693A
Publication Date:
June 13, 1995
Filing Date:
November 30, 1993
Export Citation:
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Assignee:
UBE INDUSTRIES
International Classes:
C08L77/00; C08L81/00; C08L81/02; (IPC1-7): C08L77/00; C08L81/02