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Title:
THERMOPLASTIC RESIN MOLDING
Document Type and Number:
Japanese Patent JP2009155359
Kind Code:
A
Abstract:

To provide a resin molding having high heat conductivity and excellent moldability.

In a thermoplastic resin mold, a thermoplastic resin in a dispersion phase has an island-like domain having 50-300 m of maximum diameter, and an island-like domain having 20 m or less of maximum diameter, and a ratio of the domains is 35-60 vol.% in the island-like domain having 50-300 m of maximum diameter and 60-35 vol.% in the island-like domain having 20 m or less of maximum diameter. In particular, a ratio of a matrix phase to the dispersion phase is preferably 40-70 vol.% in the matrix phase thermoplastic resin, and 60-30 vol.% in the dispersion phase thermoplastic resin.


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Inventors:
SUZUKI MASAHIRO
TAKEZAWA YOSHITAKA
KANAI ATSUSHI
KAMIHOGI YUTETSU
YAMANAKA HIROYUKI
IWATSUKI YASUHITO
HOJO FUSAO
Application Number:
JP2007331318A
Publication Date:
July 16, 2009
Filing Date:
December 25, 2007
Export Citation:
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Assignee:
SHIN KOBE ELECTRIC MACHINERY
International Classes:
C08L81/02; C08K3/00; C08L101/00
Domestic Patent References:
JPH01197559A1989-08-09
JPH0551532A1993-03-02
JPH06166816A1994-06-14
JPH04233974A1992-08-21
JPH08170024A1996-07-02
JPH05130389A1993-05-25
JPH04202247A1992-07-23
JPH0920849A1997-01-21
JP2003261687A2003-09-19
JP2001302918A2001-10-31
JP2007211087A2007-08-23
JP2007327010A2007-12-20
JP2001302917A2001-10-31
JPH07316313A1995-12-05
JPH10298431A1998-11-10
JPH03100055A1991-04-25
JPH10130502A1998-05-19
JPH10212408A1998-08-11
JP2003113307A2003-04-18
JP2003301107A2003-10-21
JP2007291222A2007-11-08
Foreign References:
WO2006030577A12006-03-23
WO2008023625A12008-02-28



 
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