Title:
THERMOSET RESIN MATERIAL FOR COMPRESSION MOLDING
Document Type and Number:
Japanese Patent JPH03139553
Kind Code:
A
Abstract:
PURPOSE:To enable the formation of a network pattern on a molded article without allowing the pattern to flow by coating a particulate molding material having a specified apparent density with a powdered material. CONSTITUTION:The title compression molding material is prepd. by coating a particulate molding material having an apparent density of 0.2-0.5 with a powdered material. As the particulate material which forms parts of the wider area of a network pattern, melamine resin, guanamine resin, urea resin, phenol resin, unsatd. polyester resin, and modified products of these resins are usable. Examples of a substrate material are a pulp, wood flour, and hollow glass, and these are used in a proper combination with the resins. The powdered material forms joint parts, i.e., peripheries of the wider parts, of the network pattern, and is obtd., e.g. by impregnating a resin into an org. substrate material comprising, e.g. a colorant for a synthetic resin and pulp, crushing the resulting product, semihardening, drying, compounding it with a hardener, pigment, release agent, etc., and grinding the resulting compsn.
Inventors:
KONDO KENKICHI
IIDA TOYOO
IIDA TOYOO
Application Number:
JP27803089A
Publication Date:
June 13, 1991
Filing Date:
October 24, 1989
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08L61/06; B29C43/00; C08L61/04; C08L61/20; C08L67/06; (IPC1-7): C08L61/06; C08L61/20; C08L67/06
Domestic Patent References:
| JPS6323216A | 1988-01-30 |
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)