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Patent Searching and Data


Title:
THERMOSETTABLE RESIN MOLDING MATERIAL AND MOLDED ARTICLE USING THE SAME
Document Type and Number:
Japanese Patent JP2001335695
Kind Code:
A
Abstract:

To provide a thermosettable resin molding material having excellent moldability and electric conductivity, and to provide a molded article for a separator for a fuel cell or the like which has excellent formability, electric conductivity, mechanical strength and gas impermeability, to be more precise.

This thermosettable resin molding material comprises 10 to 25 wt.% of a thermoset resin, 70 to 85 wt.% of graphite and 0.1 to 3 wt.% of spherical silica having an average particle size of 1/20 or smaller than the average particle size of the graphite each based on the total weight of the molding material.


Inventors:
FUJII SHUNSUKE
SUZUKI TAKAYUKI
Application Number:
JP2000155985A
Publication Date:
December 04, 2001
Filing Date:
May 26, 2000
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08J5/00; C08K3/04; C08K3/36; C08L101/00; H01B1/24; H01M8/02; (IPC1-7): C08L101/00; C08J5/00; C08K3/04; C08K3/36; H01B1/24; H01M8/02