Title:
THERMOSETTING ADHESIVE AND MOLDED SHEET USING THE SAME
Document Type and Number:
Japanese Patent JP2016222843
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a powdery thermosetting adhesive capable of being dispersed uniformly in plant pieces regardless of temperature condition and further excellent in adhesiveness.SOLUTION: A powdery thermosetting adhesive contains saccharide and camphorsulfonic acid. A molded sheet contains the thermosetting adhesive and a plurality of plant pieces adhered by the thermosetting adhesive. Because the camphorsulfonic acid has low hygroscopic property, it can be dispersed uniformly in the plant pieces regardless of temperature condition. Because the saccharide and the camphorsulfonic acid have high reaction speed, molding time can be reduced and adhesiveness can be enhanced.SELECTED DRAWING: None
Inventors:
SUGAWARA AKIRA
Application Number:
JP2015112235A
Publication Date:
December 28, 2016
Filing Date:
June 02, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C09J193/00; B27N3/00; C09J11/06; C09J105/00
Attorney, Agent or Firm:
Masakazu Ito
Satoshi Hosokawa
Takayoshi Matsumoto
Mori Taishi
Satoshi Hosokawa
Takayoshi Matsumoto
Mori Taishi
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