Title:
THERMOSETTING ADHESIVE
Document Type and Number:
Japanese Patent JPH0565468
Kind Code:
A
Abstract:
PURPOSE: To obtain a high temp.-resistant solventless powder adhesive useful as an adhesive layer with a friction brake liner by compounding a mixture of a solid phenol resin and a latent curing agent along with an inorg. pigment mixture.
CONSTITUTION: The objective adhesive contains 22-96 wt.% (especially, 30-80 wt.%) of an inorg. pigment mixture containing silica, iron oxide or kalolinite (A), 2-80 wt.% (especially, 25-55 wt.%) of novolac type solid phenol resin (B) and 2-10 wt.% (especially, 3-7 wt.%) of a latent curing agent such as hexamethylenetetramine (C).
Inventors:
HANSU KAARU ENGERUDEINGAA
YURUGEN KURAMAA
YURUGEN SHIIPUMAN
YURUGEN KURAMAA
YURUGEN SHIIPUMAN
Application Number:
JP34862191A
Publication Date:
March 19, 1993
Filing Date:
December 06, 1991
Export Citation:
Assignee:
BEIERSDORF AG
International Classes:
C08G8/00; C08K3/00; C09J161/00; C09J161/04; C09J161/06; F16D69/00; F16D69/04; (IPC1-7): C09J161/06; F16D69/04
Attorney, Agent or Firm:
Heiyoshi Odashima
Next Patent: 自動半田付け装置の搬送装置