Title:
THERMOSETTING COMPOSITION FOR PROTECTIVE FILM OF TRANSPARENT CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2013170210
Kind Code:
A
Abstract:
To provide a composition for forming a protective film which can provide a transparent conductive film with a high hardness and a high environmental resistance while maintaining the electrical contactability with the transparent conductive film including a nanostructure.
A thermosetting composition contains: a polyester amide acid obtained from a reaction of a mixture containing a tetracarboxylic dianhydride, a diamine and a polyhydric hydroxy compound as a first component; an epoxy resin as a second component; an epoxy curing agent as a third component; and a solvent as a fourth component.
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Inventors:
NAKAMOTO KEIICHI
YANAI MOTOKI
ITAMI SETSUO
YANAI MOTOKI
ITAMI SETSUO
Application Number:
JP2012034869A
Publication Date:
September 02, 2013
Filing Date:
February 21, 2012
Export Citation:
Assignee:
JNC CORP
International Classes:
C08L63/00; B82Y30/00; C08G59/42; C08L79/08; G02B1/10; G02B1/14; G09F9/30; H05K9/00