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Title:
THERMOSETTING COMPOSITION FOR SEALING ORGANIC EL ELEMENT
Document Type and Number:
Japanese Patent JP2007112956
Kind Code:
A
Abstract:

To provide a thermosetting composition for sealing an organic EL element that inhibits generation/growth of a dark spot consistently by sealing the EL element without exerting a harmful effect to it and maintains stable light-emitting performance for a long period of time by retaining high permeability.

This composition comprises (A) 100 pts.wt. of a low molecular weight epoxy resin having at least two glycidyl groups and a 200-2,000 molecular weight, (B) 40-150 pts.wt. of a high molecular weight epoxy resin having a bisphenol A or a bisphenol F epoxy backbone and a 20,000-100,000 molecular weight, (C) 0.5-20 pts.wt. of a nitrile group-containing latent imidazole compound based on 100 pts.wt. of the total amount of the (A) and (B) component, and (D) 0.1-10 pts.wt. of a silane coupling agent as main components. The organic EL element is sealed using the composition.


Inventors:
ARAI YOSHIHIDE
HORIE KENICHI
Application Number:
JP2005308269A
Publication Date:
May 10, 2007
Filing Date:
October 24, 2005
Export Citation:
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Assignee:
THREE BOND CO LTD
International Classes:
C08L63/00; C08G59/50; H01L51/50; H05B33/04
Domestic Patent References:
JPH10341083A1998-12-22
JPH02142820A1990-05-31
JP2006179318A2006-07-06
JP2004059718A2004-02-26
JP2003034708A2003-02-07
JPH10341083A1998-12-22
JPH02142820A1990-05-31
JP2006179318A2006-07-06
JP2004059718A2004-02-26
JP2003034708A2003-02-07
Foreign References:
WO2001060938A12001-08-23
WO2001060938A12001-08-23