Title:
熱硬化性組成物及び光半導体装置
Document Type and Number:
Japanese Patent JP5099911
Kind Code:
B2
Abstract:
A thermosetting composition containing an aluminosiloxane, a silicone oil containing silanol groups at both ends, and a silicone alkoxy oligomer. The thermosetting composition of the present invention can be used for, for example, encapsulating materials, coating materials, molding materials, surface-protecting materials, adhesive agents, bonding agents, and the like. Especially, in a case where the thermosetting composition of the present invention is used as an encapsulating material, the thermosetting composition is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).
Inventors:
Hiroyuki Katayama
Application Number:
JP2008233863A
Publication Date:
December 19, 2012
Filing Date:
September 11, 2008
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C08L83/14; C08G77/44; C08G79/10; C08K5/5415; C08L83/06; C08L85/00; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| JP9048787A | ||||
| JP10095852A | ||||
| JP2008274272A | ||||
| JP2005347316A | ||||
| JP2008069326A | ||||
| JP2003500411A | ||||
| JP2007270056A |
Attorney, Agent or Firm:
Yoshinori Hosoda