Title:
THERMOSETTING DIE BOND FILM, DIE BOND FILM WITH DICING SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015103573
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting die bond film having a high thermal conductivity, and arranged to be able to sufficiently follow the unevenness of an object to adhere to when being caused to adhere to the object to adhere to.SOLUTION: A thermosetting die bond film has a post-heat curing thermal conductivity of 1 W/m K or more, and comprises thermally conductive particles having a thermal conductivity of 12 W/m K or more and accounting for 75 wt.% or more to the total weight of the thermosetting die bond film, of which the melt viscosity measured at 130°C with a shear rate of 50(1/second) is 200 Pa s or less.
Inventors:
KIMURA TAKEHIRO
MISUMI SADAHITO
ONISHI KENJI
SUGAO YUKI
SHISHIDO YUICHIRO
MISUMI SADAHITO
ONISHI KENJI
SUGAO YUKI
SHISHIDO YUICHIRO
Application Number:
JP2013241284A
Publication Date:
June 04, 2015
Filing Date:
November 21, 2013
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L21/52; H01L21/301
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office