Title:
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023070763
Kind Code:
A
Abstract:
To provide a heat-curable maleimide resin composition that does not exhibit turbidity or separation in the form of a varnish, and yields a cured product that has excellent dielectric properties and has a strong adhesive force even to organic resins such as LCP and MPI and copper.SOLUTION: A heat-curable maleimide resin composition contains: (A) a styrene-based elastomer having a reactive functional group at both ends; (B) a maleimide compound represented by the following formula (1) (where R1 represents a dimer acid skeleton-derived divalent hydrocarbon group); and (C) an organic peroxide, wherein a ratio between the components (A) and (B) (mass ratio (A)/(B)) is 2 to 20.SELECTED DRAWING: None
Inventors:
TSUURA ATSUSHI
TSUTSUMI YOSHIHIRO
IGUCHI HIROYUKI
KUDO YUKI
TSUTSUMI YOSHIHIRO
IGUCHI HIROYUKI
KUDO YUKI
Application Number:
JP2021183051A
Publication Date:
May 22, 2023
Filing Date:
November 10, 2021
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08L15/00; C08F279/02; C08K5/14; C08K5/3415; C08L53/02; C09J125/08; H01L23/29; H05K1/03
Attorney, Agent or Firm:
Patent Attorney Corporation Ushiki International Patent Office