Title:
THERMOSETTING PHENOLIC RESIN COMPOSITION AND PREPREG, HONEYCOMB-SANDWICH PANEL AND LAMINATED PLATE USING THE SAME COMPOSITION
Document Type and Number:
Japanese Patent JPH04306253
Kind Code:
A
Abstract:
PURPOSE:To provide the subject thermosetting phenolic resin composition low in heating value and the amount of fuming on combustion, excellent in fluidity, adhesion and workability, capable of producing a prepreg free from uneven coating and having the smooth surface and suitable for an interior material and a structural material of an aircraft, a vehicle, etc. CONSTITUTION:With (A) >=50wt.% thermosetting phenol resin, (B) 1-15wt.% polyvinyl butyral, (C) 0.1-10wt.% modified silicone oil, (D) 0.1-30wt.% halogen- based flame-retardant, (E) 0.1-30wt.% antimony compound and (F) 0.01-1wt.% modified high-molecular silicone resin represented by formula I [R1 is formula II (R is alkyl; x and z are integer of >=1; n and y are integer of >=0)] are blended. A prepreg is obtained by impregnating a substrate with the resultant composition and a honeycomb-sandwich panel is obtained by laminating the resultant prepregs to a honeycomb core.
Inventors:
KIMURA HIROMITSU
SHINDO YASUYUKI
INABA SHINICHI
MACHIDA YOHEI
KURIHARA YOICHI
KUBOTA YOSHIAKI
HIRAI YOSHIAKI
YOSHINAGA NAOTO
SHINDO YASUYUKI
INABA SHINICHI
MACHIDA YOHEI
KURIHARA YOICHI
KUBOTA YOSHIAKI
HIRAI YOSHIAKI
YOSHINAGA NAOTO
Application Number:
JP9805791A
Publication Date:
October 29, 1992
Filing Date:
April 02, 1991
Export Citation:
Assignee:
KANEBO LTD
International Classes:
C08J5/24; C08K3/22; C08K5/15; C08K5/1515; C08K5/54; C08K5/5419; C08L29/14; C08L61/04; C08L61/06; C08L83/04; C08L83/07; (IPC1-7): C08J5/24; C08K3/22; C08K5/15; C08K5/54; C08L29/14; C08L61/06; C08L83/04