THERMOSETTING RESIN COMPOSITION, AND CURED PRODUCT THEREOF, LAMINATE, METAL BASE SUBSTRATE AND POWER MODULE

Title:

THERMOSETTING RESIN COMPOSITION, AND CURED PRODUCT THEREOF, LAMINATE, METAL BASE SUBSTRATE AND POWER MODULE

Document Type and Number:

Japanese Patent JP2023024739

Kind Code:

A

Abstract:

To provide a thermosetting resin composition that can achieve a high thermal conductivity and a high heat resistance.SOLUTION: A thermosetting resin composition contains: a bismaleimide compound that does not contain a mesogen group in the molecule and has a conjugated structure with a nitrogen atom of a maleimide group conjugated with an aromatic ring; a curing agent for the bismaleimide compound; and a thermally conductive filler having a thermal conductivity of 20 W/m K or more.SELECTED DRAWING: Figure 1

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Inventors:

Yoshiki Nishikawa
Tomo Kashino
Seiji Ohashi
Shun Hayakawa
Kusunoki Junya

Application Number:

JP2022208025A

Publication Date:

February 16, 2023

Filing Date:

December 26, 2022

Export Citation:

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Assignee:

Sumitomo Bakelite Co., Ltd.

International Classes:

C08L79/08; C08G67/00; C08G73/00; C08G73/12

Attorney, Agent or Firm:

Shinji Hayami

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