Title:
熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
Document Type and Number:
Japanese Patent JP6903915
Kind Code:
B2
Abstract:
Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).
Inventors:
Aya Kasahara
Tetsuro Irino
Murai Yo
Tetsuro Irino
Murai Yo
Application Number:
JP2016569255A
Publication Date:
July 14, 2021
Filing Date:
December 03, 2015
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
C08L79/08; B32B27/00; B32B27/34; C08K3/04; C08L27/12; H05K1/03; H05K3/46
Domestic Patent References:
| JP2014523953A | ||||
| JP11124488A |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama
Kenichi Hirasawa
Kosuke Sawayama