To provide a thermosetting resin composition exhibiting excellent low-temperature adhesive properties, a relatively slow curing rate and excellent heat resistance, a film-like adhesive comprised of the same and a semiconductor package obtained using the film-like adhesive.

The thermosetting resin composition gives a storage shear modulus of at most 0.5 MPa at least at a part of temperature ranges not higher than 100°C before thermosetting, a storage shear modulus of at least 0.2 MPa in 10 to 120 min when kept at 180°C, and a storage tensile modulus of at least 1 MPa and at most 10 MPa at 260°C after thermosetting.