Title:
THERMOSETTING RESIN COMPOSITION HAVING LOW DIELECTRIC DISSIPATION FACTOR
Document Type and Number:
Japanese Patent JP3290242
Kind Code:
B2
Abstract:
PURPOSE: To provide the subject composition comprising a specific bismaleimide compound, etc., and a specific brominated maleimide oligomer in a specified ratio, low in dielectric dissipation factor, excellent in adhesivity, flame resistance, heat resistance and chemical resistance, and suitable for printed circuit boards, etc.
CONSTITUTION: The objective composition comprises (A) a bismaleimide compound of formula I (R1-R8 are H, alkyl; R9 is divalent aliphatic group; the sum of the carbon atoms of R1-R9 is ≥9) and/or its prepolymer, and (B) a brominated maleimide oligomer having structural units of formula II (R, R' are divalent aliphatic or aromatic group) at an A/B weight ratio of 80/20 to 20/80.
Inventors:
Toshiro Takeda
Naofumi Enoki
Tao Kazunori
Sumiya Miyake
Naofumi Enoki
Tao Kazunori
Sumiya Miyake
Application Number:
JP11144793A
Publication Date:
June 10, 2002
Filing Date:
May 13, 1993
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08F222/40; C08F22/36; C08G73/06; C08K5/3415; C08L33/24; C08L79/04; C08L79/08; C09J4/00; C09J4/02; H05K1/03; (IPC1-7): C08G73/06; C08F222/40; C08K5/3415; C08L33/24; C08L79/04; C09J4/00
Domestic Patent References:
| JP6306166A | ||||
| JP6322120A | ||||
| JP6322269A | ||||
| JP56104962A | ||||
| JP5966455A | ||||
| JP3264347A | ||||
| JP598004A | ||||
| JP6100508A |
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