THERMOSETTING RESIN COMPOSITION HAVING LOW LINEAR THERMAL EXPANSION COEFFICIENT AND ITS USE

Title:

THERMOSETTING RESIN COMPOSITION HAVING LOW LINEAR THERMAL EXPANSION COEFFICIENT AND ITS USE

Document Type and Number:

Japanese Patent JP3649788

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To obtain the subject composition giving a molded article having small warpage and high dimensional stability by adding a specific carbon fiber as a reinforcing material to a thermosetting resin.
SOLUTION: This resin position contains ≥1wt.% of carbon fiber having a linear expansion coefficient of ≤0. Preferably, the linear expansion coefficient of the fiber is -2×10-6 to -0.1×10-6/°C and the fiber is a combination of chopped strand fiber and milled fiber of polyacrylonitrile-based carbon fiber having an average fiber diameter of 5-10μm and a length of 30-150μm.

Inventors:

Sakuma Kazumasa
Keita Takagi

Application Number:

JP27785495A

Publication Date:

May 18, 2005

Filing Date:

October 25, 1995

Export Citation:

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Assignee:

Asahi Glass Matex Co., Ltd.

International Classes:

C08J5/04; B32B17/10; B32B18/00; C08K3/02; C08K3/04; C08K7/00; C08K7/06; C08L101/00; G02B6/24; (IPC1-7): B32B17/10; B32B18/00; C08J5/04; G02B6/24

Domestic Patent References:

JP60206821A
JP7188527A
JP2194588A

Attorney, Agent or Firm:

Mamoru Tsunoda

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