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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION FOR IN-MOLD COATING
Document Type and Number:
Japanese Patent JPH0710942
Kind Code:
A
Abstract:

PURPOSE: To obtain a resin composition which produces a coating layer excellent in appearance such as gloss, quality and adhesion to molding materials in in- mold coating by incorporating respectively specific thermostting resin and finely divided powder of the cured product.

CONSTITUTION: This resin composition comprises one or more thermosetting resins selected from unsaturated polyester resins, urethane acrylate resins and epoxy acrylate resins (e.g. an unsaturated polyester resin prepared from maleic anhydride, isophthalic acid and propylene glycol) and a finely divided powder of the cured product of one or more of the thermosetting resins.


Inventors:
MORISHITA NATSUKI
TSUJI TOSHIMITSU
Application Number:
JP15706693A
Publication Date:
January 13, 1995
Filing Date:
June 28, 1993
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B29C43/20; C08F2/44; C08F290/00; C08F299/00; B29K105/06; (IPC1-7): C08F299/00; B29C43/20; C08F2/44