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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION AND ITS PREPOLYMER
Document Type and Number:
Japanese Patent JPS5989326
Kind Code:
A
Abstract:

PURPOSE: To provide a novel thermosetting resin composition having excellent heat resistance and flexibility, useful as a heat-resistant insulation varnish, etc., and containing a polyfunctional epoxy compound and a polyfunctional α-ketonitrile compound.

CONSTITUTION: The objective thermosetting resin composition is prepared by compounding a polyfunctional epoxy compound (e.g. bisphenol A diglycidyl ether) and a polyfunctional α-ketonitrile compound (e.g. phthaloyl cyanide), adding a curing catalyst (e.g. boron trifluoride), and if necessary, a filler, a pigment, a solvent, etc. to the composition. The composition can be cured easily by heating at 0W400°C for 1W200hr.

EFFECT: The cured resin has excellent electrical properties, chemical resistance, impact resistance, and self-extinguishing properties.


Inventors:
KOYAMA TOORU
SUZUKI KATSUTO
MUKAI JIYUNJI
Application Number:
JP19893482A
Publication Date:
May 23, 1984
Filing Date:
November 15, 1982
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C08G59/00; C08G59/40; C08G73/00; C08G73/06; (IPC1-7): C08G59/40; C08G73/06
Attorney, Agent or Firm:
Katsuo Ogawa (2 outside)