To provide a thermosetting resin composition for light reflection having high reflectance of from visible light to near ultraviolet light after curing, excellent heat deterioration resistance and tablet moldability as well as less molding flash upon transfer molding, and to provide a photosemiconductor element-loading substrate using the resin composition, a photosemiconductor device and manufacturing processes for the articles.
This thermosetting resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E) a white pigment, and (F) a coupling agent. When a transfer molding using the resin composition is performed under a condition in which a molding temperature is 100-200C, molding pressure is 20 MPa, and a molding period of time is 60-120 seconds, a length of the molding flash is 5 mm, as well as the light reflectance at a wavelength of 350-800 nm after curing is 80%. The photosemiconductor element-loading substrate using the resin composition, the photosemiconductor device and these manufacturing processes are also disclosed.
URASAKI NAOYUKI
YUASA KANAKO
NAGAI AKIRA
HAMADA MITSUYOSHI
| JPH06209024A | 1994-07-26 | |||
| JP2006140207A | 2006-06-01 | |||
| JPH0459863A | 1992-02-26 | |||
| JP2001118969A | 2001-04-27 | |||
| JP2001158614A | 2001-06-12 |
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu