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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION OF LOW SHRINKAGE
Document Type and Number:
Japanese Patent JPH01261411
Kind Code:
A
Abstract:

PURPOSE: To obtain the title resin compsn. exhibiting low shrinkage in oxidation, providing a cured molded item having good surface flatness and luster and exhibiting neither contamination of a mold nor color shading, by incorporating an inorg. filler treated with a specified resin.

CONSTITUTION: This thermosetting resin compsn. is prepd. by incorporating a treated inorg. filler obtd. by stirring and mixing a poly(oxazoline) (e.g., 2- ethyl-2-oxazoline homopolymer or copolymer) and/or a modified poly(oxazoline) [e.g, a partially hydrolyzed product of said poly(oxazoline)] and an inorg. filler at 0W400°C. According to said procedure, curing shrinkage is low and a cured molded item having good surface flatness and luster can be provided. Moreover, a thermosetting resin compsn. of low shrinkage exhibiting neither contamination of a mold nor color shading can be formed.


Inventors:
MINAMI KENJI
KAWAMURA KIYOSHI
SANO SADANORI
Application Number:
JP8828388A
Publication Date:
October 18, 1989
Filing Date:
April 12, 1988
Export Citation:
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Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
C08L67/06; C08F299/04; (IPC1-7): C08F299/04; C08L67/06