Title:
THERMOSETTING RESIN COMPOSITION AND THERMOSETTING RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2006282813
Kind Code:
A
Abstract:
To provide a thermosetting resin composition with extremely high setting speed and a thermosetting resin molding material.
This thermosetting resin composition comprises a novolac phenol resin (a), a polyacetal resin (b) and a hydrogen ion releasable polymer (c) as essential ingredients. The hydrogen ion releasable polymer (c) is a hydrogen type cation-exchange resin and contains a sulfone group as a functional group. The thermosetting resin molding material comprises the thermosetting resin composition and a filler.
Inventors:
TAKIHANA YOSHIHIRO
Application Number:
JP2005103565A
Publication Date:
October 19, 2006
Filing Date:
March 31, 2005
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L61/10; C08L59/00; C08L101/00