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Title:
THERMOSETTING RESIN COMPOSITION AND THERMOSETTING RESIN MOLDING MATERIAL, AND THEIR HARDENED PRODUCTS
Document Type and Number:
Japanese Patent JP2007063439
Kind Code:
A
Abstract:

To provide a thermosetting resin composition exhibiting a very fast hardening speed, a thermosetting resin molding material using the same, and their hardened products.

The thermosetting resin composition comprises a novolac phenol resin (a), a polyacetal resin (b), a compound (c) which releases an acidic substance having a dissociation constant pKa of 2 or smaller, at a specific temperature by thermal decomposition, and decomposes at a temperature of 120°C or higher, and a compound (d) decomposing at a temperature lower than 120°C. By using the compound (d) decomposing at a temperature lower than 120°C together with the compound (c) decomposing at a temperature of 120°C or higher, the hardening is started earlier even in an occasion that the starting of hardening is too late when the compound (c) which exhibits higher decomposition temperature is used alone, and the productivity of molding is improved.


Inventors:
HORIE MICHIYASU
KOHARA SHIGEYOSHI
Application Number:
JP2005252625A
Publication Date:
March 15, 2007
Filing Date:
August 31, 2005
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G81/00; C08K5/42; C08L59/00; C08L61/06