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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION AND THERMOSETTING RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2007070549
Kind Code:
A
Abstract:

To provide a thermosetting resin composition with extremely high setting speed and a thermosetting resin molding material.

The thermosetting resin composition comprises a novolac phenol resin (a), a polyacetal resin (b), and smectite (c) as essential ingredients. The smectite is obtained by ion-exchanging in advance cations present between layers in the layered structure with one or more kinds of cations having catalytic activity. The thermosetting resin molding material comprising the thermosetting resin composition and a filler is also provided.


Inventors:
TAKIHANA YOSHIHIRO
Application Number:
JP2005261319A
Publication Date:
March 22, 2007
Filing Date:
September 08, 2005
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L61/08; C08K3/34; C08K9/02; C08L59/00