Title:
THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN MOLDING MATERIAL AND CURED MATERIAL THEREOF
Document Type and Number:
Japanese Patent JP2007186670
Kind Code:
A
Abstract:
To obtain a thermosetting resin composition having an extremely high curing rate, a thermosetting resin molding material using the same and a cured material thereof.
The thermosetting resin composition comprises a novolak type phenol resin, a polyacetal resin and a curing catalyst composed of an alicyclic hydrocarbon compound such as 4,4'-bis(p-toluenesulfonic acid)bicyclohexyl, etc., containing a hydroxy group and a sulfonic acid group and having two ring structures.
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Inventors:
HORIE MICHIYASU
KOHARA SHIGEYOSHI
KOHARA SHIGEYOSHI
Application Number:
JP2006243161A
Publication Date:
July 26, 2007
Filing Date:
September 07, 2006
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L61/10; C08K5/42; C08L59/00