THERMOSETTING RESIN COMPOSITION AND THERMOSETTING RESIN MOLDING MATERIAL

Title:

THERMOSETTING RESIN COMPOSITION AND THERMOSETTING RESIN MOLDING MATERIAL

Document Type and Number:

Japanese Patent JP2007204530

Kind Code:

A

Abstract:

To obtain a thermosetting resin composition having an extremely high curing rate and a thermosetting resin molding material.

The thermosetting resin composition comprises a novolak type phenol resin (a), a polyacetal resin (b) and a heteropoly acid (c) as essential components. The thermosetting resin molding material comprises the thermosetting resin composition and a filler.

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Inventors:

YAMAMORI YOSHIYUKI
TAKIHANA YOSHIHIRO

Application Number:

JP2006022439A

Publication Date:

August 16, 2007

Filing Date:

January 31, 2006

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO

International Classes:

C08L61/06; C08G8/10; C08K3/34; C08L59/00

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