To provide a thermosetting resin composition that has a very high curing rate and exhibits excellent thermal stability, a thermosetting resin molding material and a cured product thereof.

The thermosetting resin composition comprises a novolak-type phenolic resin (a), a curing agent (b) and a curing accelerator (c), where the curing accelerator (c) is a sulfonic acid anhydride. The thermosetting resin composition comprises as the curing accelerator (c) an aromatic sulfonic acid anhydride bearing at least one sulfonic group and/or a perfluoroalkylsulfonic acid anhydride. The thermosetting resin molding material comprises the thermosetting resin composition and a filler. The cured product is obtained by curing these.