Title:
THERMOSETTING RESIN COMPOSITION, PRODUCTION METHOD FOR SMOOTH PLATE, AND SMOOTH PLATE PRODUCED THEREBY
Document Type and Number:
Japanese Patent JP3911690
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is useful for an undercoat, etc., of a printed circuit board, etc., gives a cured film containing no air bubble, and has an easily polishable surface; and a smooth printed circuit board, etc.
SOLUTION: This resin composition contains (I) an adduct of an epoxy resin and an unsaturated fatty acid, (II) a methacrylate, (III) a free-radical polymerization initiator, (IV) a crystalline epoxy resin, and (V) a latent curing agent.
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Inventors:
Kiyoshi Sato
Kazunori Kitamura
Kazunori Kitamura
Application Number:
JP2001253678A
Publication Date:
May 09, 2007
Filing Date:
July 19, 2001
Export Citation:
Assignee:
Sanei Chemical Co., Ltd.
International Classes:
C08F290/06; C08F283/10; C08G59/18; C08G59/20; C08L63/00; C08L63/10; H01L23/498; H05K3/46; H05K3/00; H05K3/28; (IPC1-7): C08G59/20; C08F290/06; H05K3/46
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