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Title:
THERMOSETTING RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
Japanese Patent JP2002047391
Kind Code:
A
Abstract:

To provide a thermosetting resin composition for sealing which has good moldability such as a flow property or an adhesion property, good reflow crack resistance and is reliable to such as moisture resistance or a high- temperature aging characteristic and is excellent storage stability, and to provide an electronic component device equipped with the elements sealed with it.

The thermosetting resin composition for sealing contains (A) a thermosetting resin having a dihydrobenzoxazine ring, (B) an epoxy resin, (C) a phenolic resin, (D) an ion scavenger and (E) an inorganic filler. The melt viscosity of a resin composition consisting of the components (A), (B) and (C) at 150°C is 2 poise or below and the content of the component (D) is kept to 0.5-20 pts.wt. based on 100 pts.wt. of the resin component.


Inventors:
NAGASE HIDEO
AIZAWA TERUKI
NANAUMI KEN
Application Number:
JP2000231515A
Publication Date:
February 12, 2002
Filing Date:
July 31, 2000
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L63/00; C08G59/62; C08K3/00; C08L61/34; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/62; C08K3/00; C08L61/34; H01L23/29; H01L23/31
Domestic Patent References:
JP2001131393A2001-05-15
JP2000327882A2000-11-28
JPH11140278A1999-05-25
JP2001234026A2001-08-28
JPH11158349A1999-06-15
JPH1160898A1999-03-05
JPH11240937A1999-09-07
JPH0448759A1992-02-18
JP2000204139A2000-07-25
JPH11217416A1999-08-10
JP2000086863A2000-03-28
Attorney, Agent or Firm:
Hidekazu Miyoshi (8 outside)



 
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