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Title:
THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR BONDING AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014074132
Kind Code:
A
Abstract:

To provide a thermosetting resin composition for semiconductor bonding, which has high thermal conductivity and excellent heat dissipation properties and is capable of satisfactorily joining a semiconductor element to a metal substrate.

The thermosetting resin composition for semiconductor bonding contains, as essential components: (A) a (meth)acrylic ester compound or a (meth)acrylamide compound which has a hydroxyl group; (B) a radical initiator; (C) fine silver particles having an average particle diameter of 10-100 nm, which are provided with a coating layer of an organic compound on their surfaces or are dispersed in an organic compound; (D) a silver powder having an average particle diameter of 0.5-30 μm; and (E) a solvent. A semiconductor device is manufactured using the thermosetting resin composition.


Inventors:
FUJIWARA MASAKAZU
SATAKE YUU
NINAI YUYA
Application Number:
JP2012222979A
Publication Date:
April 24, 2014
Filing Date:
October 05, 2012
Export Citation:
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Assignee:
KYOCERA CHEM CORP
International Classes:
C08F2/44; C08F20/28; C08F20/58; C09J4/02; C09J9/02; C09J11/04; H01B1/00; H01B1/22; H01L21/52
Domestic Patent References:
JP2007238680A2007-09-20
JP2006206730A2006-08-10
JP2000265118A2000-09-26
JP2000290597A2000-10-17
JP2012182184A2012-09-20
JP2007238680A2007-09-20
JP2006206730A2006-08-10
JP2000265118A2000-09-26
JP2000290597A2000-10-17
JP2012182184A2012-09-20
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office



 
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