Title:
熱硬化性樹脂組成物、熱硬化性接着剤、熱硬化性樹脂フィルム並びに前記熱硬化性樹脂組成物を用いた積層板、プリプレグ、及び回路基板
Document Type and Number:
Japanese Patent JP7286569
Kind Code:
B2
Abstract:
To provide a thermosetting resin composition, a thermosetting adhesive and a thermosetting resin film which are excellent in adhesion to a metallic foil, have high Tg and low dielectric characteristics, and are excellent in compatibility of each component and thereby are less in curing unevenness and characteristic variations in curing, and a prepreg, a laminate and a circuit board using the same.SOLUTION: A thermosetting resin composition contains 100 pts.mass of (A) a polyphenylene ether resin having a reactive double bond in a molecular chain terminal, 10-50 pts.mass of (B) a (meth)acrylate compound, 30-100 pts.mass of (C) a cyclic imide compound, 0.3-10 pts.mass of (D) a reaction initiator, and 0.3-10 pts.mass of (E) an adhesive auxiliary containing an epoxy resin having two or more epoxy groups in one molecule.SELECTED DRAWING: None
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Inventors:
Atsushi Tsuura
Hiroyuki Iguchi
Yuki Kudo
Yoshihiro Tsutsumi
Hiroyuki Iguchi
Yuki Kudo
Yoshihiro Tsutsumi
Application Number:
JP2020024747A
Publication Date:
June 05, 2023
Filing Date:
February 17, 2020
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L71/12; C08F222/40; C08J5/24; C08K3/013; C08K5/14; C08L63/00; C09J7/35; C09J171/12; H05K1/03
Domestic Patent References:
| JP2020002217A | ||||
| JP2018028078A | ||||
| JP2010229274A | ||||
| JP2015004009A |
Foreign References:
| WO2018030112A1 | ||||
| WO2019188187A1 | ||||
| WO2014181456A1 |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi