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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2001064480
Kind Code:
A
Abstract:

To obtain the subject composition capable of shortening a curing time in molding without reducing characteristics of the cured product such as strength and the like by bringing the composition to contain a phenol novolak resin, hexamethylene tetramine and aspecific compound.

This thermosetting resin composition is obtained by comprising 100 pts.wt. of (A) a phenol novolak resin, 7-30 pts.wt. of hexamethylenetetramine and 0.5-30 pts.wt. of (C) a compound expressed by the formula (R1 to R4 are each H, a monovalent alkyl, a monovalent aryl or an alkoxy; R5 is a monovalent alkyl or aryl) and having one 3,4-dihydro-2H-1,3-benzooxazine structure in the molecule. As the ingredient A, a random novolak obtained by reacting (i) a phenol with (ii) a formaldehyde in 0.4-0.95 molar ratio (ingredients ii/i) in the presence of (iii) an acidic catalyst having 0.65-0.9 ortho/para ratio and ≤10 wt.% amount free phenol is preferable.


Inventors:
OKANUMA MASAKO
Application Number:
JP24408999A
Publication Date:
March 13, 2001
Filing Date:
August 30, 1999
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L61/10; C08G8/28; C08G14/073; C08K5/3477; C08K5/357; (IPC1-7): C08L61/10; C08G14/073; C08K5/3477