Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2004204199
Kind Code:
A
Abstract:
To provide a thermosetting resin composition used for impregnating or coating, without having tacking property on drying at a normal temperature, and curable at a low temperature.
This thermosetting resin composition is provided by incorporating a diallyl phthalate resin, and/or an unsaturated polyester resin, especially the unsaturated polyester resin being a solid at a normal temperature and MMA.
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Inventors:
UCHIKATA MASAMI
YUUKO HIROKAZU
YUUKO HIROKAZU
Application Number:
JP2002383637A
Publication Date:
July 22, 2004
Filing Date:
December 25, 2002
Export Citation:
Assignee:
FUJI POLYMER IND
International Classes:
C08F283/01; C09D4/00; C09D4/06; C09D5/00; C09D131/08; C09D167/06; C08F263/08; (IPC1-7): C08F263/08; C08F283/01; C09D4/00; C09D4/06; C09D5/00; C09D131/08; C09D167/06
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