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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2008075026
Kind Code:
A
Abstract:

To provide a thermosetting resin composition which is excellent in UV ray durability, heat resistance, and adhesiveness, and is not peeled also after a reflow treatment.

This thermosetting resin composition comprises (A) a polyorganosiloxane having an epoxy equivalent of 1,600 g/mole, (B) a metal chelate compound, and (C) an oxetane ring-having compound.


Inventors:
YOSHII KIMIHIKO
KAJITA TORU
AKIIKE TOSHIYUKI
Application Number:
JP2006257893A
Publication Date:
April 03, 2008
Filing Date:
September 22, 2006
Export Citation:
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Assignee:
JSR CORP
International Classes:
C08L63/00; C08G59/20; C08G59/70; C08K5/07; C08K5/15; C09J11/06; C09J171/02; C09J183/06; C09K3/10; H01L23/29; H01L23/31; H01L33/62
Attorney, Agent or Firm:
Masataka Oshima



 
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