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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2017186479
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has a high refractive index, gas barrier properties, and thermal shock resistance and is excellent in reliability as an LED sealing material.SOLUTION: The thermosetting resin composition contains the following (A), (B) and (C): (A) a thermosetting resin having SiH groups and alkenyl groups, which is a reaction product of a silsesquioxane having SiH groups and an organopolysiloxane having two alkenyl groups; (B) a linear compound having SiH groups at both terminals, at least one isocyanurate in the main chain, and a siloxane chain as a main structure; and (C) a Pt catalyst.SELECTED DRAWING: None

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Inventors:
TAJIMA AKIO
MATSUO TAKASHI
ICHIKAWA KOJI
AYAMA KYOICHI
Application Number:
JP2016077953A
Publication Date:
October 12, 2017
Filing Date:
April 08, 2016
Export Citation:
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Assignee:
JNC CORP
International Classes:
C08L83/05; C08G77/50; C08L83/07
Domestic Patent References:
JP2013216827A2013-10-24
JP2013181162A2013-09-12
JP2012162666A2012-08-30
JP2015172146A2015-10-01
Foreign References:
WO2014077216A12014-05-22
WO2017110468A12017-06-29



 
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