Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2021191840
Kind Code:
A
Abstract:
To provide a thermosetting resin composition having good adhesiveness, and excellent in heat resistance, and electric characteristics.SOLUTION: A thermosetting resin composition (Z) is provided which contains: epoxy-modified polyolefin (X); and a curing agent (Q), and in which the epoxy-modified olefin (X) includes, as constitutional materials, polyolefin (A) and an epoxy group-containing vinyl monomer (B), the weight ratio [ethylene/3-8C α-olefin] of ethylene which is a constitution monomer of the polyolefin (A) and the 3-8C α-olefin is 2/98-50/50, and the epoxy-modified polyolefin (X) satisfies any of the following requirements (1)-(3).SELECTED DRAWING: None
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Inventors:
HIGUCHI SHINTARO
Application Number:
JP2021071033A
Publication Date:
December 16, 2021
Filing Date:
April 20, 2021
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08G59/20; B32B15/08; B32B15/085; B32B27/00; B32B27/26; B32B27/32; C08F8/00; C08L23/26; C09J7/30; C09J123/26; H01L23/29; H01L23/31