Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3258126
Kind Code:
B2
Abstract:
PURPOSE: To provide a composition for obtaining a thermosetting resin which is free from drawbacks of a thermosetting resin having carbodiimide bonds, i.e., which has excellent heat resistance and good melt flowability and cures in a short time.
CONSTITUTION: The composition comprises as essential components a polycarbodiimide compound having two or more carbodiimide bonds per molecule and a phenol derivative having two or more allyl groups per molecule.
Inventors:
Bunmei Ichikawa
Tadashi Asanuma
Hiromi Nakano
Akihiro Yamaguchi
Tadashi Asanuma
Hiromi Nakano
Akihiro Yamaguchi
Application Number:
JP8646693A
Publication Date:
February 18, 2002
Filing Date:
April 13, 1993
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08G18/02; C08G18/67; C08G18/83; C08K5/105; C08L79/08; (IPC1-7): C08G18/83; C08K5/105; C08L79/08
Domestic Patent References:
| JP6107945A | ||||
| JP61235415A |
Attorney, Agent or Firm:
Eisuke Fujimoto (2 outside)