Title:
熱硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP6909281
Kind Code:
B2
Abstract:
A thermosetting resin composition, whereina cured product of the thermosetting resin composition that has been cured at 130°C for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85°C and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.
Inventors:
Kenzo Onizuka
Naomi Kozumi
Takanori Maeda
Naomi Kozumi
Takanori Maeda
Application Number:
JP2019506305A
Publication Date:
July 28, 2021
Filing Date:
March 16, 2018
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C08G59/50; C08K3/013; C08L63/00
Domestic Patent References:
| JP2014051621A | ||||
| JP2009173763A | ||||
| JP2007297604A | ||||
| JP63307984A | ||||
| JP2015174967A | ||||
| JP2013001875A | ||||
| JP2013105960A | ||||
| JP2015221859A | ||||
| JP2016108429A | ||||
| JP2015113426A | ||||
| JP2014152236A | ||||
| JP2016130287A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito