Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0450261
Kind Code:
A
Abstract:
PURPOSE:To obtain a thermosetting resin composition having excellent formability and heat-resistance without losing excellent properties of aromatic polyamides by compounding a maleimide derivative to an aromatic polyamide oligomer having cyclic aliphatic unsaturated group on the terminal. CONSTITUTION:The objective thermosetting resin composition can be produced by compounding (A) 100 pts.wt. of an aromatic polyamide oligomer produced by reacting a cyclic unsaturated imide compound or a cyclic unsaturated acid anhydride with an aromatic diamine and an aromatic dicarboxylic acid dihalide in the presence of a hydrogen halide acceptor, having cyclic aliphatic unsaturated group on the terminal and expressed by formula I [R1 and R3 are bivalent aromatic group; R3 is bivalent aliphatic group or aromatic group; A and B are bivalent aliphatic unsaturated group (A may be same to B) of formula II (R<1> and R<2> are H or CH3; at least one of R<1> and R<2> is H); m is 0 or 1; n is 1-15] with (B) 10-200 pts.wt. of a maleimide derivative (e.g. phenylmaleimide, aromatic dimaleimide or aromatic polymaleimide).
Inventors:
HOSOGANE TADAYUKI
NAKAJIMA HIROSHI
NAKAJIMA HIROSHI
Application Number:
JP16022290A
Publication Date:
February 19, 1992
Filing Date:
June 18, 1990
Export Citation:
Assignee:
SHOWA HIGHPOLYMER
International Classes:
C07D209/48; C07C237/10; C07C237/22; C07D207/452; C07D209/52; C07D209/94; C08F22/36; C08F222/40; C08F290/00; C08F299/00; C08F299/02; C08G69/48; C08K5/34; C08K5/3415; C08L61/20; C08L61/32; C08L77/00; C08L77/10; (IPC1-7): C07C237/22; C07D207/452; C07D209/48; C07D209/94; C08F222/40; C08F299/00; C08K5/34; C08L77/00
Attorney, Agent or Firm:
Kikuchi Seiichi
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