PURPOSE: To obtain a thermosetting resin composition which comprises a specific (meth)allyl-containing compound and a maleimide group-containing compound and is excellent in heat resistance, low dielectric properties, chemical resistance, mechanical strength, water resistance and is useful in adhesives, coating materials and composite materials such as laminated boards.

CONSTITUTION: This composition comprises (A) a compound of formula I [R1-R3 are each H, methyl; R4-R6 are each a 1-5C alkyl, phenyl, tolyl, xylyl; X is CH2, C(CH3)2, SO2; (n) is 0-5], for example, 2,2-di[acetyloxy-3-(meth) allylphenyl]propane, di[4-acetyloxy-3-(meth)allylphenyl]methane, and (B) a compound of formula II bearing a maleimide group in the molecule (D is a divalent group) containing a C=C double bond, for example, N-methylmaleimide or the compound of formula III.