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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS52123498
Kind Code:
A
Abstract:

PURPOSE: To produce title resin composition having good resistance to heat and thermal shock after curing, by compounding a specific polyfunctional epoxy compound with a polyfunctional compound and a during catalyst.


Inventors:
NUMATA SHIYUNICHI
YOKONO ATARU
MUKAI JIYUNJI
Application Number:
JP3920476A
Publication Date:
October 17, 1977
Filing Date:
April 09, 1976
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C08G18/00; C08G18/58; (IPC1-7): C08G18/58



 
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