熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール

Title:

熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール

Document Type and Number:

Japanese Patent JP7151834

Kind Code:

B2

Abstract:

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

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Inventors:

Shunsuke Nobouchi
Tomokazu Shimada
Kazutoshi Masahara
Fukuda Tomio
Minoru Kakitani

Application Number:

JP2021119588A

Publication Date:

October 12, 2022

Filing Date:

July 20, 2021

Export Citation:

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Assignee:

Showa Denko Materials Co., Ltd.

International Classes:

C08J5/24; C08G73/00; C08K3/013; C08L9/06; C08L35/06; C08L79/00; H05K1/03

Domestic Patent References:

JP2015224304A
JP2014024926A
JP2016008229A
JP50153098A

Foreign References:

US20160008229

Attorney, Agent or Firm:

Patent Attorney Corporation Otani Patent Office

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