Title:
Thermosetting resin compositions and semiconductor devices for semiconductor adhesion
Document Type and Number:
Japanese Patent JP6347684
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for semiconductor bonding which has excellent bleeding resistance and high adhesion, and a semiconductor device having excellent solder crack resistance.SOLUTION: The thermosetting resin composition for semiconductor bonding contains (A) an epoxy resin, (B) a sulfur-containing hemiacetal ester derivative (a carboxylic acid derivative in which a carboxyl group is made thermally latent by a vinyl ether compound), (C) an amine-based curing agent, (D) an imidazole-based curing accelerator, (E) a filler, and (F) a reactive diluent and/or an organic solvent. The semiconductor device is obtained using the resin composition.SELECTED DRAWING: Figure 1
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Inventors:
Yuu Satake
Masakazu Fujiwara
Niuchi Yuya
Masakazu Fujiwara
Niuchi Yuya
Application Number:
JP2014140026A
Publication Date:
June 27, 2018
Filing Date:
July 07, 2014
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
C09J163/00; C08G59/50; C09J5/06; C09J11/04; C09J11/06; H01L21/52
Domestic Patent References:
| JP2010077266A | ||||
| JP2006245242A | ||||
| JP2003277483A | ||||
| JP2006028477A | ||||
| JP2008174711A | ||||
| JP2012162710A | ||||
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| JP2015017175A | ||||
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| JP2009286824A |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office